This versatile, 5th generation, total-etch bonding system bonds to virtually all direct and indirect restorations Bond light or chemical cured composites, porcelains, metal restorations, and amalgam to the tooth structure. Dual-cure activator allows for compatibility with most self- and dual-cure resin materials. Low film thickness of only 8µm assures the ideal surface for bonding. **For further product information, please contact Chat Support**